Camera module

ABSTRACT

A camera module includes a lens; an image sensor disposed on a substrate and converting an optical signal refracted by the lens into an electrical signal, an adhesive member disposed between the substrate and the image sensor to fix the image sensor to the substrate, and a support member disposed between the substrate and the image sensor configured to maintain a constant distance between the lens and the image sensor even at a time of shrinkage-deformation of the adhesive member.

CROSS-REFERENCE TO RELATED APPLICATIONS

This application is a continuation of U.S. patent application Ser. No.16/750,344 filed on Jan. 23, 2020, which claims the benefit under 35 USC119(a) of Korean Patent Application No. 10-2019-0058814 filed on May 20,2019, in the Korean Intellectual Property Office, the entire disclosureof which is incorporated herein by reference for all purposes.

BACKGROUND 1. Field

The present disclosure relates to a camera module.

2. Description of the Background

A camera module may include an optical imaging system including one ormore lenses and an image sensor. The optical imaging system may includeone or more lenses having refractive power, and may form an image oflight reflected from a subject with the image sensor. The image sensormay convert an optical signal refracted by the optical imaging systeminto an electrical signal.

Optical performance of the camera module is affected by a distance fromthe optical imaging system to the image sensor. For example, when adistance from the rearmost lens (a lens closest to the image sensor) ofthe optical imaging system to the image sensor is different from anoptical design value or a rear focal length of the optical imagingsystem, an accurate image of the subject is not formed on an imagingplane of the image sensor.

However, in a camera module, the image sensor may be fixed to asubstrate using an adhesive, and a position of the image sensor may thusbe changed in a process of curing the adhesive.

The above information is presented as background information only toassist with an understanding of the present disclosure. No determinationhas been made, and no assertion is made, as to whether any of the abovemight be applicable as prior art with regard to the disclosure.

SUMMARY

This Summary is provided to introduce a selection of concepts in asimplified form that are further described below in the DetailedDescription. This Summary is not intended to identify key features oressential features of the claimed subject matter, nor is it intended tobe used as an aid in determining the scope of the claimed subjectmatter.

In one general aspect, a camera module includes a lens, an image sensordisposed on a substrate and converting an optical signal refracted bythe lens into an electrical signal, an adhesive member disposed betweenthe substrate and the image sensor to fix the image sensor to thesubstrate, and a support member disposed between the substrate and theimage sensor configured to maintain a constant distance between the lensand the image sensor even at a time of shrinkage-deformation of theadhesive member.

The support member may be disposed along a lower edge of the imagesensor.

The adhesive member may be partially disposed in a diagonal direction ofthe image sensor.

The support member may have a bonding wire form.

The bonding wire may include a horizontal portion in line contact with alower portion of the image sensor.

In another general aspect, a camera module includes a lens, a substratehaving a groove, an image sensor disposed in the groove and convertingan optical signal refracted by the lens into an electrical signal, anadhesive member fixing the image sensor to the groove, and a supportmember disposed in the groove configured to maintain a constant distancebetween the lens and the image sensor even at a time ofshrinkage-deformation of the adhesive member.

The adhesive member may be disposed between inner surfaces of the grooveand side surfaces of the image sensor.

The substrate may include a first substrate member in which athrough-hole corresponding to the groove is formed, and a secondsubstrate member coupled to the first substrate member and closing alower portion of the through-hole.

In another general aspect, a camera module includes a substrate, asupport member disposed on the substrate, an image sensor disposed onthe support member, and an adhesive member bonded to the substrate andthe image sensor, wherein the adhesive member thickness in a directionfrom the substrate to the image sensor is predetermined by the imagesensor disposed against the support member.

The camera module may further include a lens configured to refract lightincluding an optical signal converted by the image sensor to anelectrical signal.

The support member may be spaced apart from the adhesive member.

The image sensor may be disposed on a bottom surface of a groove in thesubstrate, and the adhesive member may be further disposed on a sidesurface of the image sensor between inner surfaces of the groove.

The adhesive member may urge the image sensor against the supportmember.

The support member may include a plastically deformed portion to alignthe image sensor and the lens by a predetermined distance.

Other features and aspects will be apparent from the following detaileddescription, the drawings, and the claims.

BRIEF DESCRIPTION OF DRAWINGS

FIG. 1 is a cross-sectional view of a camera module according to one ormore examples.

FIG. 2 is an enlarged view of part A illustrated in FIG. 1.

FIG. 3 is a cross-sectional view taken along line B-B of FIG. 2.

FIG. 4 is a cross-sectional view of a camera module according to one ormore other examples.

FIG. 5 is an enlarged view of part D illustrated in FIG. 4.

FIG. 6 is a cross-sectional view of a camera module according one ormore still other examples.

FIG. 7 is an enlarged view of part E illustrated in FIG. 6.

FIG. 8 is a cross-sectional view of a camera module according one ormore still other examples.

FIG. 9 is an enlarged view of part F illustrated in FIG. 8.

Throughout the drawings and the detailed description, the same referencenumerals refer to the same elements. The drawings may not be to scale,and the relative size, proportions, and depiction of elements in thedrawings may be exaggerated for clarity, illustration, and convenience.

DETAILED DESCRIPTION

The following detailed description is provided to assist the reader ingaining a comprehensive understanding of the methods, apparatuses,and/or systems described herein. However, various changes,modifications, and equivalents of the methods, apparatuses, and/orsystems described herein will be apparent after an understanding of thisdisclosure. For example, the sequences of operations described hereinare merely examples, and are not limited to those set forth herein, butmay be changed as will be apparent after an understanding of thisdisclosure, with the exception of operations necessarily occurring in acertain order. Also, descriptions of features that are known in the artmay be omitted for increased clarity and conciseness.

The features described herein may be embodied in different forms, andare not to be construed as being limited to the examples describedherein. Rather, the examples described herein have been provided merelyto illustrate some of the many possible ways of implementing themethods, apparatuses, and/or systems described herein that will beapparent after an understanding of this disclosure. Hereinafter, whileembodiments of the present disclosure will be described in detail withreference to the accompanying drawings, it is noted that examples arenot limited to the same.

Throughout the specification, when an element, such as a layer, region,or substrate, is described as being “on,” “connected to,” or “coupledto” another element, it may be directly “on,” “connected to,” or“coupled to” the other element, or there may be one or more otherelements intervening therebetween. In contrast, when an element isdescribed as being “directly on,” “directly connected to,” or “directlycoupled to” another element, there can be no other elements interveningtherebetween.

As used herein, the term “and/or” includes any one and any combinationof any two or more of the associated listed items; likewise, “at leastone of” includes any one and any combination of any two or more of theassociated listed items.

Although terms such as “first,” “second,” and “third” may be used hereinto describe various members, components, regions, layers, or sections,these members, components, regions, layers, or sections are not to belimited by these terms. Rather, these terms are only used to distinguishone member, component, region, layer, or section from another member,component, region, layer, or section. Thus, a first member, component,region, layer, or section referred to in examples described herein mayalso be referred to as a second member, component, region, layer, orsection without departing from the teachings of the examples.

Spatially relative terms such as “above,” “upper,” “below,” and “lower”may be used herein for ease of description to describe one element'srelationship to another element as shown in the figures. Such spatiallyrelative terms are intended to encompass different orientations of thedevice in use or operation in addition to the orientation depicted inthe figures. For example, if the device in the figures is turned over,an element described as being “above” or “upper” relative to anotherelement will then be “below” or “lower” relative to the other element,Thus, the term “above” encompasses both the above and below orientationsdepending on the spatial orientation of the device. The device may alsobe oriented in other ways (for example, rotated 90 degrees or at otherorientations), and the spatially relative terms used herein are to beinterpreted accordingly.

The terminology used herein is for describing various examples only, andis not to be used to limit the disclosure. The articles “a,” “an,” and“the” are intended to include the plural forms as well, unless thecontext clearly indicates otherwise. The terms “comprises,” “includes,”and “has” specify the presence of stated features, numbers, operations,members, elements, and/or combinations thereof, but do not preclude thepresence or addition of one or more other features, numbers, operations,members, elements, and/or combinations thereof.

Due to manufacturing techniques and/or tolerances, variations of theshapes shown in the drawings may occur. Thus, the examples describedherein are not limited to the specific shapes shown in the drawings, butinclude changes in shape that occur, for example, during manufacturing.

The features of the examples described herein may be combined in variousways as will be apparent after an understanding of this disclosure.Further, although the examples described herein have a variety ofconfigurations, other configurations are possible as will be apparentafter an understanding of this disclosure.

Herein, it is noted that use of the term “may” with respect to anexample, for example, as to what an example may include or implement,means that at least one example exists in which such a feature isincluded or implemented while all examples are not limited thereto.

One or more examples of a camera module in which a distance from therearmost lens of an optical imaging system to an image sensor isaccurately maintained are described herein.

A camera module according to the present disclosure may be configured sothat a distance between a lens and an image sensor is constantlymaintained. For example, the camera module according to the presentdisclosure may include support members disposed between the image sensorand a substrate. The support members may constantly maintain a relativeposition of the image sensor to the lens even at a time ofshrinkage-deformation of an adhesive applied to a lower portion of theimage sensor.

The support member may be formed of a material that is easilyplastically-deformed. For example, the support member may be formed of amaterial that is a metal and is easily deformed, such as a bonding wire.The support member formed as described above may enable adjustment ofthe relative position of the image sensor to the lens.

Hereinafter, various examples will be described with reference to thedrawings.

First, a camera module according to one or more examples will bedescribed with reference to FIGS. 1 through 3.

A camera module 10 according to the present example may include anoptical imaging system 100, a substrate 200, and an image sensor 300. Inaddition, the camera module 10 may further include an adhesive member400 and support members 500.

The optical imaging system 100 may include one or more lenses. Forexample, the optical imaging system 100 according to the present examplemay include a first lens 110, a second lens 120, and a third lens 130.However, the number of lenses constituting the optical imaging system100 is not limited to three. For example, the optical imaging system 100may include two or less or four or more lenses. The optical imagingsystem 100 may have a focal length. For example, the optical imagingsystem 100 may have a predetermined back focal length (BF). The opticalimaging system 100 may further include a filter (not illustrated) forcutting oft an infrared ray. In this case, the filter may be disposedbetween the rearmost lens (the third lens 130 in the present example)and the image sensor 300.

The first lens 110 may have positive refractive power. An object-sidesurface of the first lens 110 may be convex, and an image-side surfacethereof may be convex. The first lens 110 may have an asphericalsurface. For example, at least one of the object-side surface and theimage-side surface of the first lens 110 may be aspherical. The secondlens 120 may have positive refractive power. An object-side surface ofthe second lens 120 may be concave, and an image-side surface thereofmay be convex. The second lens 120 may have an aspherical surface. Forexample, at least one of the object-side surface and the image-sidesurface of the second lens 120 may be aspherical. The third lens 130 mayhave positive or negative refractive power. An object-side surface ofthe third lens 130 may be concave, and an image-side surface thereof maybe convex. The third lens 130 may have an aspherical surface. Forexample, at least one of the object-side surface and the image-sidesurface of the third lens 130 may be aspherical.

One or more electronic components may be mounted on the substrate 200.For example, connection pads for electrical connection to the electroniccomponents may be formed on the substrate 200. The substrate 200 mayelectrically connect the electronic components mounted thereon to eachother. For example, circuits for connecting the connection pads to eachother may be formed on the substrate 200. The circuits may be formed ona surface of and inside the substrate 200.

The image sensor 300 may be disposed on the substrate 200. For example,the image sensor 300 may be disposed above the substrate 200. The imagesensor 300 may convert an optical signal refracted by the opticalimaging system 100 into an electrical signal.

The adhesive member 400 may be formed between the substrate 200 and theimage sensor 300. For example, the adhesive member 400 may be partiallyformed in a diagonal direction of the substrate 200 or the image sensor300, as illustrated in FIG. 3. In addition, the adhesive member 400 maybe formed from a central portion of the substrate 200 or the imagesensor 300 along width and length directions of the substrate 200 or theimage sensor 300. The adhesive member 400 formed as described above maybe photo-cured or thermally cured to firmly fix the image sensor 300 tothe substrate 200.

The support members 500 may be formed on the substrate 200, For example,the support members 500 may be formed at intervals along a lower edge ofthe image sensor 300 as illustrated in FIG. 3. The support member 500may have a bonding wire form. The support members 500 formed asdescribed above may be rapidly and easily formed in a wire bondingprocess of electrically connecting the substrate 200 and the electroniccomponents to each other. The support members 500 may support the imagesensor 300 at a first height h1. Here, the first height h1 may be in arange of approximately 110 to 140 μm. In addition, the support members500 may be formed between the substrate 200 and the image sensor 300 tomaintain a constant distance (that is, a back focal length BF) betweenthe optical imaging system 100 and the image sensor 300. For example,the support members 500 may solve a phenomenon in which a distancebetween the substrate 200 and the image sensor 300 is decreased and thedistance between the optical imaging system 100 and the image sensor 300is increased due to shrinkage-curing of the adhesive member 400.

Therefore, in the camera module 10 according to the present example,quality deterioration phenomenon of the camera module 10 due to theshrinkage-curing of the adhesive member 400 may be significantlyalleviated.

A camera module according to one or more other examples will bedescribed with reference to FIGS. 4 and 5.

A camera module 20 according to the present example may include anoptical imaging system 100, a substrate 200, and an image sensor 300. Inaddition, the camera module 20 may further include an adhesive member400 and support members 500.

The optical imaging system 100 may include one or more lenses. Forexample, the optical imaging system 100 according to the present examplemay include a first lens 110, a second lens 120, and a third lens 130.The optical imaging system 100 may have a focal length. For example, theoptical imaging system 100 may have a predetermined back focal length(BF).

The first lens 110 may have positive refractive power. An object-sidesurface of the first lens 110 may be convex, and an image-side surfacethereof may be concave. The first lens 110 may have an asphericalsurface. For example, at least one of the object-side surface and theimage-side surface of the first lens 110 may be aspherical. The secondlens 120 may have positive or negative refractive power. An object-sidesurface of the second lens 120 may be convex, and an image-side surfacethereof may be concave. The second lens 120 may have an asphericalsurface. For example, at least one of the object-side surface and theimage-side surface of the second lens 120 may be aspherical. The thirdlens 130 may have positive or negative refractive power. An object-sidesurface of the third lens 130 may be concave, and an image-side surfacethereof may be convex. The third lens 130 may have an asphericalsurface. For example, at least one of the object-side surface and theimage-side surface of the third lens 130 may be aspherical.

One or more electronic components may be mounted on the substrate 200.For example, connection pads for electrical connection to the electroniccomponents may be formed on the substrate 200. The substrate 200 mayelectrically connect the electronic components mounted thereon to eachother. For example, circuits for connecting the connection pads to eachother may be formed on the substrate 200. The circuits may be formed ona surface of and inside the substrate 200.

The image sensor 300 may be disposed on the substrate 200. For example,the image sensor 300 may be disposed above the substrate 200. The imagesensor 300 may convert an optical signal refracted by the opticalimaging system 100 into an electrical signal.

The adhesive member 400 may be formed between the substrate 200 and theimage sensor 300. For example, the adhesive member 400 may be partiallyformed in a diagonal direction of the substrate 200 or the image sensor300, as illustrated in FIG. 3. In addition, the adhesive member 400 maybe formed from a central portion of the substrate 200 or the imagesensor 300 along width and length directions of the substrate 200 or theimage sensor 300. The adhesive member 400 formed as described above maybe photo-cured or thermally cured to firmly fix the image sensor 300 tothe substrate 200.

The support members 500 may be formed on the substrate 200. For example,the support members 500 may be formed at intervals along a lower edge ofthe image sensor 300 or a diagonal length direction of the image sensor300. The support member 500 may have a bonding wire form. The supportmembers 500 formed as described above may be rapidly and easily formedin a wire bonding process of electrically connecting the substrate 200and the electronic components to each other. In addition, the supportmember 500 according to the present example may be configured in abonding wire form having a horizontal portion 510. As an example, thesupport member 500 having such a form may be formed by pressing abonding wire having a curved shape with a predetermined force. Asanother example, a bonding wire having the horizontal portion 510 may beformed by pressing the image sensor 300 in a state in which the imagesensor 300 is put on the support member 500. When the support member 500is formed by the latter method, a distance decrease phenomenon betweenthe optical imaging system 100 and the image sensor 300 due to excessiveapplication of the adhesive member 400 may be solved. The horizontalportion 510 formed as described above may be in line contact with alower portion of the image sensor 300 to firmly support the image sensor300.

The support members 500 may support the image sensor 300 at a secondheight h2 that is significantly low. Here, the second height h2 may bein a range of approximately 50 to 70 μm. In addition, the supportmembers 500 may be formed between the substrate 200 and the image sensor300 to maintain a constant distance (that is, a back focal length BF)between the optical imaging system 100 and the image sensor 300. Forexample, the support members 500 may solve a phenomenon in which adistance between the substrate 200 and the image sensor 300 is decreasedand the distance between the optical imaging system 100 and the imagesensor 300 is increased due to shrinkage-curing of the adhesive member400.

Therefore, in the camera module 20 according to the present example,quality deterioration phenomenon of the camera module 20 due to theshrinkage-curing of the adhesive member 400 and the excessiveapplication of the adhesive member 400 may be significantly alleviated.

A camera module according to one or more other examples will bedescribed with reference to FIGS. 6 and 7.

A camera module 30 according to the present example may include anoptical imaging system 100, a substrate 200, and an image sensor 300. Inaddition, the camera module 30 may further include an adhesive member400 and support members 500.

The optical imaging system 100 may include one or more lenses. Forexample, the optical imaging system 100 according to the present examplemay include a first lens 110, a second lens 120, and a third lens 130.The optical imaging system 100 may have a focal length. For example, theoptical imaging system 100 may have a predetermined back focal length(BF).

The first lens 110 may have positive refractive power. An object-sidesurface of the first lens 110 may be convex, and an image-side surfacethereof may be concave. The first lens 110 may have an asphericalsurface. For example, at least one of the object-side surface and theimage-side surface of the first lens 110 may be aspherical. The secondlens 120 may have positive or negative refractive power. An object-sidesurface of the second lens 120 may be concave, and an image-side surfacethereof may be convex. The second lens 120 may have an asphericalsurface. For example, at least one of the object-side surface and theimage-side surface of the second lens 120 may be aspherical. The thirdlens 130 may have positive or negative refractive power. An object-sidesurface of the third lens 130 may be concave, and an image-side surfacethereof may be convex. The third lens 130 may have an asphericalsurface. For example, at least one of the object-side surface and theimage-side surface of the third lens 130 may be aspherical.

One or more electronic components may be mounted on the substrate 200.For example, connection pads for electrical connection to the electroniccomponents may be formed on the substrate 200. The substrate 200 mayelectrically connect the electronic components mounted thereon to eachother. For example, circuits for connecting the connection pads to eachother may be formed on the substrate 200. The circuits may be formed ona surface of and inside the substrate 200. The substrate 200 may includea groove 202 accommodating the image sensor 300 therein. The groove 202may be formed at a significant depth Dp. For example, the depth Dp ofthe groove 202 may be substantially the same as a height h of the imagesensor 300. However, the depth Up of the groove 202 is not necessarilythe same as the height h of the image sensor 300.

The image sensor 300 may be disposed in the groove 202 of the substrate200. The image sensor 300 may convert an optical signal refracted by theoptical imaging system 100 into an electrical signal.

The adhesive member 400 may be formed between the substrate 200 and theimage sensor 300. For example, the adhesive member 400 may be formedbetween inner surfaces of the groove 202 and side surfaces of the imagesensor 300, as illustrated in FIG. 7. However, a position of theadhesive member 400 is not limited to the portion described above. Forexample, the adhesive member 400 may be formed between a bottom surfaceof the groove 202 and a lower portion of the image sensor 300. Theadhesive member 400 formed as described above may be photo-cured orthermally cured to firmly fix the image sensor 300 to the substrate 200.

The support members 500 may be formed on the substrate 200. For example,the support members 500 may be formed at intervals along a lower edge ofthe image sensor 300 or a diagonal length direction of the image sensor300. The support member 500 may have a bonding wire form. The supportmembers 500 formed as described above may be rapidly and easily formedin a wire bonding process of electrically connecting the substrate 200and the electronic components to each other. In addition, the supportmember 500 according to the present example may be configured in abonding wire form having a horizontal portion 510. As an example, thesupport member 500 having such a form may be formed by pressing abonding wire having a curved shape with a predetermined force. Asanother example, a bonding wire having the horizontal portion 510 may beformed by pressing the image sensor 300 in a state in which the imagesensor 300 is put on the support member 500. When the support member 500is formed by the latter method, a distance decrease phenomenon betweenthe optical imaging system 100 and the image sensor 300 due to excessiveapplication of the adhesive member 400 may be solved. The horizontalportion 510 formed as described above may be in line contact with alower portion of the image sensor 300 to firmly support the image sensor300.

The support members 500 may support the image sensor 300 at a secondheight h2 that is significantly low. Here, the second height h2 may bein a range of approximately 50 to 70 μm. In addition, the supportmembers 500 may be formed between the substrate 200 and the image sensor300 to maintain a constant distance (that is, a back focal length BF)between the optical imaging system 100 and the image sensor 300. Forexample, the support members 500 may solve a phenomenon in which adistance between the substrate 200 and the image sensor 300 is decreasedand the distance between the optical imaging system 100 and the imagesensor 300 is increased due to shrinkage-curing of the adhesive member400.

Therefore, in the camera module 30 according to the present example,quality deterioration phenomenon of the camera module 30 due to theshrinkage-curing of the adhesive member 400 and the excessiveapplication of the adhesive member 400 may be significantly alleviated.In addition, in the camera module 30 according to the present example,the image sensor 300 may be disposed in the groove 202 of the substrate200, such that an entire height of the camera module 30 may bedecreased.

A camera module according to one or more other examples will bedescribed with reference to FIGS. 8 and 9.

A camera module 40 according to the present example may include anoptical imaging system 100, a substrate 200, and an image sensor 300. Inaddition, the camera module 40 may further include an adhesive member400 and support members 500.

The optical imaging system 100 may include one or more lenses. Forexample, the optical imaging system 100 according to the present examplemay include a first lens 110, a second lens 120, and a third lens 130.The optical imaging system 100 may have a focal length. For example, theoptical imaging system 100 may have a predetermined back focal length(BF).

The first lens 110 may have positive refractive power. An object-sidesurface of the first lens 110 may be convex, and an image-side surfacethereof may be convex. The first lens 110 may have an asphericalsurface. For example, at least one of the object-side surface and theimage-side surface of the first lens 110 may be aspherical. The secondlens 120 may have positive or negative refractive power. An object-sidesurface of the second lens 120 may be concave, and an image-side surfacethereof may be convex. The second lens 120 may have an asphericalsurface. For example, at least one of the object-side surface and theimage-side surface of the second lens 120 may be aspherical. The thirdlens 130 may have positive or negative refractive power. An object-sidesurface of the third lens 130 may be concave, and an image-side surfacethereof may be concave. The third lens 130 may have an asphericalsurface. For example, at least one of the object-side surface and theimage-side surface of the third lens 130 may be aspherical.

The substrate 200 may include a plurality of members. For example, thesubstrate 200 may include a first substrate member 210 and a secondsubstrate member 220. A through-hole 212 in which the image sensor 300may be disposed may be formed in the first substrate member 210. Thethrough-hole 212 may have a shape substantially similar to that of theimage sensor 300. For example, the through-hole 212 may have asubstantially rectangular cross-sectional shape, similar to the imagesensor 300. A cross section of the through-hole 212 may be substantiallygreater than that of the image sensor 300. A depth of the through-hole212 may be substantially same as a height of the image sensor 300.However, the depth of the through-hole 212 is not necessarily the sameas the height of the image sensor 300, The second substrate member 220may be disposed beneath the first substrate member 210. The secondsubstrate member 220 may be formed at a size that is substantially thesame as that of the first substrate member 210, In addition, the secondsubstrate member 220 may close the through-hole 212 of the firstsubstrate member 210, The second substrate member 220 may be attached toa lower portion of the first substrate member 210 in a process ofmanufacturing the adhesive member 400 or the substrate 200.

The image sensor 300 may be disposed in the through-hole 212 of thefirst substrate member 210. The image sensor 300 may convert an opticalsignal refracted by the optical imaging system 100 into an electricalsignal.

The adhesive member 400 may be formed between the substrate 200 and theimage sensor 300. For example, the adhesive member 400 may be formedbetween the second substrate member 220 and the image sensor 300, asillustrated in FIG. 9. The adhesive member 400 formed as described abovemay be photo-cured or thermally cured to firmly fix the image sensor 300to the substrate 200.

A portion of the one or more electronic components described above asmounted on the substrate 200 may be mounted on the second substratemember 220.

The support members 500 may be formed on the second substrate member220. For example, the support members 500 may be formed at intervalsalong a lower edge of the image sensor 300 or a diagonal lengthdirection of the image sensor 300. The support member 500 may have abonding wire form. The support members 500 formed as described above maybe rapidly and easily formed in a wire bonding process of electricallyconnecting the second substrate member 220 and the electronic componentsto each other. In addition, the support member 500 according to thepresent example may be configured in a bonding wire form having ahorizontal portion 510. As an example, the support member 500 havingsuch a form may be formed by pressing a bonding wire having a curvedshape with a predetermined force. As another example, a bonding wirehaving the horizontal portion 510 may be formed by pressing the imagesensor 300 in a state in which the image sensor 300 is put on thesupport member 500, When the support member 500 is formed by the lattermethod, a distance decrease phenomenon between the optical imagingsystem 100 and the image sensor 300 due to excessive application of theadhesive member 400 may be solved. The horizontal portion 510 formed asdescribed above may be in line contact with a lower portion of the imagesensor 300 to firmly support the image sensor 300.

The support members 500 may support the image sensor 300 at a secondheight h2 that is significantly low. Here, the second height h2 may bein a range of approximately 50 to 70 μm. In addition, the supportmembers 500 may be formed between the substrate 200 and the image sensor300 to maintain a constant distance (that is, a back focal length BF)between the optical imaging system 100 and the image sensor 300. Forexample, the support members 500 may solve a phenomenon in which adistance between the substrate 200 and the image sensor 300 is decreasedand the distance between the optical imaging system 100 and the imagesensor 300 is increased due to shrinkage-curing of the adhesive member400.

Therefore, in the camera module 40 according to the present example,quality deterioration phenomenon of the camera module 40 due to theshrinkage-curing of the adhesive member 400 and the excessiveapplication of the adhesive member 400 may be significantly alleviated.In addition, in the camera module 40 according to the example, the imagesensor 300 may be disposed in the groove 212 of the first substratemember 210, such that an entire height of the camera module 40 may bedecreased.

As set forth above, according to the one or more examples describedherein, reliability for optical performance of a camera module may beimproved.

While specific examples have been shown and described above, it will beapparent after an understanding of this disclosure that various changesin form and details may be made in these examples without departing fromthe spirit and scope of the claims and their equivalents. The examplesdescribed herein are to be considered in a descriptive sense only, andnot for purposes of limitation. Descriptions of features or aspects ineach example are to be considered as being applicable to similarfeatures or aspects in other examples. Suitable results may be achievedif the described techniques are performed in a different order, and/orif components in a described system, architecture, device, or circuitare combined in a different manner, and/or replaced or supplemented byother components or their equivalents. Therefore, the scope of thisdisclosure is defined not by the detailed description, but by the claimsand their equivalents, and all variations within the scope of the claimsand their equivalents are to be construed as being included in thisdisclosure.

What is claimed is:
 1. A camera module comprising: a lens; an imagesensor disposed on a substrate; an adhesive member disposed between thesubstrate and the image sensor; and a support member disposed on thesubstrate and contacted with the image sensor, wherein the supportmember comprises a bonding wire form.
 2. The camera module of claim 1,wherein the support member is disposed along a lower edge of the imagesensor.
 3. The camera module of claim 1, wherein the adhesive member ispartially disposed in a diagonal direction of the image sensor.
 4. Thecamera module of claim 1, wherein the bonding wire comprises ahorizontal portion in line contact with a lower portion of the imagesensor.
 5. A camera module comprising: a lens; a substrate comprising agroove; an image sensor disposed in the groove; an adhesive memberfixing the image sensor to the groove; and a support member disposed inthe groove configured to maintain a constant distance between the lensand the image sensor, wherein the support member comprises a bondingwire form.
 6. The camera module of claim 5, wherein the adhesive memberis disposed between inner surfaces of the groove and side surfaces ofthe image sensor.
 7. The camera module of claim 5, wherein the substratecomprises: a first substrate member in which a through-holecorresponding to the groove is formed; and a second substrate membercoupled to the first substrate member and closing a lower portion of thethrough-hole.
 8. The camera module of claim 5, wherein the bonding wirecomprises a horizontal portion in line contact with a lower portion ofthe image sensor.
 9. A camera module, comprising: a substrate; a supportmember disposed on the substrate; an image sensor disposed on thesupport member; an adhesive member bonded to the substrate and the imagesensor, wherein the adhesive member thickness in a direction from thesubstrate to the image sensor is predetermined by the image sensordisposed against the support member; and a lens, wherein the supportmember comprises a plastically deformed portion to align the imagesensor and the lens by a predetermined distance.
 10. The camera moduleof claim 9, wherein the support member is spaced apart from the adhesivemember.
 11. The camera module of claim 9, wherein the image sensor isdisposed on a bottom surface of a groove in the substrate, and theadhesive member is further disposed on a side surface of the imagesensor between inner surfaces of the groove.
 12. The camera module ofclaim 9, wherein the adhesive member urges the image sensor against thesupport member.
 13. A camera module comprising: a lens; a substratecomprising a groove; an image sensor disposed in the groove; an adhesivemember fixing the image sensor to the groove; and a support memberdisposed in the groove and contacted with a bottom of the image sensor,wherein the substrate comprises: a first substrate member in which athrough-hole corresponding to the groove is formed; and a secondsubstrate member coupled to the first substrate member and closing alower portion of the through-hole.
 14. The camera module of claim 13,wherein the adhesive member is disposed between inner surfaces of thegroove and side surfaces of the image sensor.
 15. The camera module ofclaim 13, wherein the support member is disposed along a lower edge ofthe image sensor.
 16. The camera module of claim 13, wherein theadhesive member is partially disposed in a diagonal direction of theimage sensor.
 17. The camera module of claim 13, wherein the supportmember is spaced apart train the adhesive member.
 18. The camera moduleof claim 13, wherein the adhesive member urges the image sensor againstthe support member.